Board-to-Board Socket Connectors

Exclusive solder ball terminal design provides a stronger solder joint while compensating for minor coplanarity issues on the PC board surface. Solder balls provide more solder on each joint than less-effective solder bump terminal designs, ensuring a reliable connection.

• Socket Connectors for telecom requirements. Designed to pass the 20-day mixed flowing gas (MFG) test required in many telecom and other severe environment and life-long applications.
• Low 4.0mm stack height makes it ideal for tight mezzanine packaging applications.
• Per contact rating of greater than 1 Amp at 8°C ambient.
• Dual row configurations include 8, 14, or 36 total positions with other pin counts available.

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• Heavy-duty, shrouded design provides positive polarization to aid in blind mating applications.
• Low stack heights, high I/O density and compact insulator conserve valuable PC board space.
• High density 0.050" (1.27mm) pitch - over 400 contacts per sq. in.

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• Standard connectors include single, dual, and triple row designs on 1.27mm, 2.00mm, or 2.54mm pitch.
• Male (headers) and female connectors (sockets/receptacles) are designed in mating pairs.
• Unique options include staggered patterns, right angle connectors, and Peel-A-Way® Removable Terminal Carriers for complete solder.

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0.100" (2.54mm Pitch)
0.079" (2.00mm Pitch)
0.050" (1.27mm Pitch)
Peel-A-Way® Zig-Zag Sockets

• 0.100" (2.54mm) pitch Single and Dual row.
• Single row models feature 0.018" (0.46mm) diameter male pins in FR-4 insulators.
• Dual row models feature 0.025" (0.64mm) diameter male in molded LCP insulators.

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