Adapters & Converters

• Reduce high-density interconnect (HDI) construction by adapting smaller pitch devices to larger footprints
• Convert 0.4mm and 0.5mm pitch footprints to 1.0mm or 1.27mm
• Enable the use of standard line and trace spacing
• Eliminate the need for laser-drilled micro vias motherboard

• Adapt to fine pitch footprints including TSSOPs and QFPs with pitches down to 0.4mm
• Features raised connection pads up to 0.010" (0.25mm)
• Available in tape-and-reel for high-speed surface-mount technology (SMT) assembly
• Can be manufactured for RoHS Compliance

• Correct-A-Chip™ technology solves problems associated with the use of alternate ICs by eliminating the need for new PCBs
• Available in either 0.300" (7.62mm) or 0.600" (15.24mm) row-to-row spacing

• Converts PLCC packaged ICs-to-DIP footprints
• Ideal for prototyping and testing/evaluation
• Available with PLCC sockets or PLCC Pads on top side

A cost-effective means of upgrading to SOIC without changing your printed circuit board layout for adapters on 0.400" (10.16mm) or 0.600" (15.24mm) centers.

Converts PLCC packaged ICs to DIP footprints for prototyping, testing, and evaluation. Available with with PLCC sockets or pads on top side.

Convert surface-mount QFP packages to a 13 x 13 PGA footprint, reducing costs by using less-expensive QFP packages to replace PGA footprints in existing designs.

Convert Motorola's DSP56000/001 QFP surface-mount packages to a 13 x 13 to PGA footprint, reducing costs by using less-expensive QFP packages.

Designed to convert rectangular type, 0.050" (1.27mm) pitch SOIC devices for soldering or socketing in a dual in-line (DIP or DIL) application.

Convert BGA, LGA, or other device packages to an existing QFP to QFP with the same or different footprint. Available in 0.50mm to 1.27mm pitch.

Adapts JEDEC 0.050" (1.27mm) pitch PLCC packages (Leaded Type A) to standard PGA footprints. Polarization pin option available.