Package Conversion Adapters

SOIC to DIP QFP Adapters PLCC to PGA Peel-A-Way® Removable Carriers Test Pins & Terminal Jacks
SOIC to DIP Adapters QFP Adapters PLCC to PGA Adapters Peel-A-Way® Removable Carrier Test Pins & Terminal Jacks

Designed to convert rectangular type, 0.050" (1.27mm) pitch SOIC devices for soldering or socketing in a dual in-line (DIP or DIL) application.

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Convert BGA, LGA, or other device packages to an existing QFP to QFP with the same or different footprint. Available in 0.50mm to 1.27mm pitch.

Adapts JEDEC 0.050" (1.27mm) pitch PLCC packages (Leaded Type A) to standard PGA footprints. Polarization pin option available.

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Standard strips are available in single, dual, and triple row designs on 1.27mm, 2.0mm or 2.54mm pitch. Standard configurations from 2 to 100 positions per row.

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Hundreds of standard and custom designs available for SMT and thru-hole applications. New spring pin designs are available on a custom basis.