Pressure Sensitive Cover Tape

Applications:

• Surface Mount Device (SMD) Packaging: The tape rolls that have microchips, resistors, capacitors, etc., are sealed well in SMD packaging for automated assembly.
• Printed Circuit Board (PCB) Manufacturing: The proper protection and spacing of electronic components ensure their exact location during the PCB assembly process.
• Semiconductor Packaging: The semiconductor components that have been employed in different electronic devices are kept safe and transported.
• Light Emitting Diode (LED) and Optoelectronic Component Packaging: LED chip, optical sensors, and other light-sensitive components are well sealed within the packaging material.
• Automotive Electronics Production: Utilized in packaging sensors, microcontrollers, and other essential automotive electronic components.
• Medical Device Assembly: Shields electronic components applied in medical devices like diagnostic tools and wearable health monitors.
• Consumer Electronics Production: Utilized in the production of smartphones, tablets, laptops, and other consumer electronic products.
• Telecommunications Equipment Manufacturing: Facilitates secure packaging of microprocessors, RF modules, and other communication-related parts.
• Industrial Automation Systems: Supports packaging electronic components used in robotics, control systems, and automated devices.
• Aerospace and Defense Electronics: Provides reliable sealing for precision electronic components used in avionics and defense systems.

Features

• Strong Pressure-Sensitive Adhesive: Provides a secure and reliable bond without requiring heat activation.
• Clear Visibility: Transparent material allows easy inspection of components within the carrier tape.
• ESD Protection Options: Available in electrostatic discharge (ESD) safe versions to protect sensitive electronic components.
• Compatible with Various Carrier Tapes: Works with a wide range of carrier tape materials for different packaging needs.
• Consistent Peel Force: Ensures smooth and controlled removal for automated pick-and-place assembly.
• Durable and Flexible: Maintains adhesion during transport, storage, and handling without becoming brittle.
• Moisture and Contaminant Resistance: Helps protect components from environmental factors.
• Wide Application Range: Suitable for SMD packaging, PCB assembly, semiconductor handling, and more.
• Easy Application: Simple to use in automated or manual taping processes, reducing production downtime.
• High Reliability: Designed to meet industry standards for electronic component packaging.