The new CxV Series Blade tips have been designed for BGA pad clean-up and are used with the MFR-H2-ST Hand-piece. These high-mass tips are used for solder removal and pad leveling applications. Independently tested by one of the world.s largest semi-conductor manufacturers, these tips are a low-cost, highly effective and non-damaging means for BGA pad clean-up.
The CxV Series Blade Tips are used exclusively with the new MFR-2220* or MFR-2222* Dual Simultaneous Output Soldering and Rework System. Employing SmartHeat® Technology, these systems feature fixed temperature, and variable power that assures a quick and well controlled response to thermal load.
NOTE: MFR-2220 systems include the MFR-H2-ST hand-piece required for use with the CxV blade tips.
|PAC Part Number||I164360|
|MFG Part Number||CFV-BL350|
|Compatibility||Metcal MFR-H2-ST, Metcal PS-HC3|