Test & Burn-In Sockets

Burn-In sockets are Zero Insertion Force (ZIF) sockets that do not deform a device's leads. Standard devices include: CSP, BGA, LGA, QFP, QFN/MLF, PGA, SOIC, SOJ, TSOP, TO, DIP, SIP. Custom sockets are available for non-standard devices. Receptacles, also known as Socket Savers, are available for most socket requirements.

We are a primary provider of leading Test & Burn-In socket manufacturers that include Aries Electronics, Enplas, Ironwood Electronics, Loranger, Plastronics, Sensata Technologies, Wells-CTI, and Yamaichi Electronics.

Aries Electronics Enplas Loranger Ironwood Electronics
Plastronics Sockets & Connectors Sensata Technologies Wells CTI Yamaichi Electronics
High GHz Test & Burn-In Sockets (SBT Group) ZIF Chip Scale Package (CSP) Land Grid Array (LGA) Through-Hole (QFN) Open Grid (OQN)
High GHz Test/Burn-In Socket Chip Scale Package (CSP) Socket Land Grid Array (LGA) Socket Through-Hole (QFN) Socket Open Quad (OQN) Socket
  • BGA, LGA, QFN/MLF, QFP & SOIC
  • 7 to 31.7 GHz, -55° to +180°C
  • 0.4 to 1.27mm Pitch
  • BGA, QFP, QFN/MLF, TSSOP
  • Compression Mount or Through-Hole
  • 0.4 to 0.8mm Pitch
  • ZIF
  • 0.25mm Pitch and Greater
  • Up to 2,500 Contacts
  • 0.25mm to 0.44mm Pitch
  • C-res. 50m-ohm or less, 10,000 life cycle
  • Clam Shell or Open Top
  • 0.5mm to 0.65mm Pitch
  • C-res. 50m-ohm or less, 10,000 life cycle
  • -65° to +150°C
BGA/LGA LGA/BGA BGA/FBGA FBGA BGA Memory Sockets
BGA/LGA Socket LGA/BGA Socket BGA/FBGA Socket FBGA Socket BGA Memory Socket
  • Compression Surface Mount
  • Open Top or Clam Shell
  • 0.65 to 0.4mm Pitch
  • Open Top or Clam Shell
  • 800m-ohm or Less, 10,000 Life Cycle
  • 0.8 to 1.27mm Pitch
  • Open Top or Clam Shell
  • 10,000 Life Cycle
  • 0.5mm to 1.0mm Pitch
  • Open Top
  • 0.75mm-0.8mm Pitch
  • -65° to +150°C
  • Open Top Actuated Sockets
  • Multiple Package Outlines & Heights
  • Removable Adapter
QFP for Gull Wing Leads SO, SOIC, Gull Wing, Open Top, Through Hole TSOP Unique Positive Locking Lid Transistor Outline (TO) Socket Receptacles
QFP Socket SOIC Socket TSOP Socket TO Socket Socket Receptacle
  • Open Top or Clam Shell
  • 0.4 to 1.0mm Pitch
  • 0,000 Life Cycles; -65° to +150°C
  • SOP: 1.27mm
  • SSOP: 0.5 to 0.8mm
  • TSSOP: 0.5 to 0.65mm
  • SMT & ZIF
  • For Prototyping, OEM, Test
  • With or Without Alignment Pins
  • Top-Loading & Clam Shell (ZIF)
  • Kelvin & Single-Sided Contacts
  • Positive Contact Wiping Action
  • Protect Valuable Test & Burn-In sockets
  • Can be Custom Manufactured
  • Soldered or Wire wrapped to the PCB
PGA - ZIF ZIP DIP LCC PLCC Optical Transceiver Sockets
PGA - ZIF Socket ZIP DIP Socket LCC Socket PLCC Socket Optical Transceiver Socket
  • Over 10,000 Insertions
  • 10x10 to 25x25 Grid on 1.00mm Centers
  • Fully Loaded or Custom Pattern
  • Over 10,000 Insertions
  • 0.100" (2.54 mm)
  • 14 to 64 Leads
  • Open Top or Clam Shell
  • From 0.25mm
  • Live or Dead Bug Options
  • Surface Mount/Through-Hole
  • RoHS Compliant
  • Compatible with Automated Loading Equipment
  • Surface Mount
  • 0.5 to 1.27mm
  • 50,000 Insertions