Test & Burn-In Sockets

Burn-In sockets are Zero Insertion Force (ZIF) sockets that do not deform a device's leads. Standard devices include: CSP, BGA, LGA, QFP, QFN/MLF, PGA, SOIC, SOJ, TSOP, TO, DIP, SIP. Custom sockets are available for non-standard devices. Receptacles, also known as Socket Savers, are available for most socket requirements.

We are a primary provider of leading Test & Burn-In socket manufacturers that include Aries Electronics, Enplas, Ironwood Electronics, Loranger, Plastronics, Sensata Technologies, Wells-CTI, and Yamaichi Electronics.

Aries Electronics
Enplas
Loranger
Ironwood Electronics
Sensata Technologies
Plastronics Sockets & Connectors
Yamaichi Electronics
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High GHz Test/Burn-In Socket

High GHz (SBT Group) ZIF

  • BGA, LGA, QFN/MLF, QFP & SOIC
  • 7 to 31.7 GHz, -55° to +180°C
  • 0.4 to 1.27mm Pitch

Chip Scale Package (CSP) Socket

Chip Scale Package (CSP)

  • BGA, QFP, QFN/MLF, TSSOP
  • Compression Mount or Through-Hole
  • 0.4 to 0.8mm Pitch

Land Grid Array (LGA) Socket

Land Grid Array (LGA)

  • ZIF
  • 0.25mm Pitch and Greater
  • Up to 2,500 Contacts

Through-Hole (QFN) Socket

Through-Hole (QFN)

  • 0.25mm to 0.44mm Pitch
  • C-res. 50m-ohm or less, 10,000 life cycle
  • Clam Shell or Open Top

Open Quad (OQN) Socket

Open Grid (OQN)

  • 0.5mm to 0.65mm Pitch
  • C-res. 50m-ohm or less, 10,000 life cycle
  • -65° to +150°C

BGA/LGA Socket

BGA/LGA

  • Compression Surface Mount
  • Open Top or Clam Shell
  • 0.65 to 0.4mm Pitch

LGA/BGA Socket

LGA/BGA

  • Open Top or Clam Shell
  • 800m-ohm or Less, 10,000 Life Cycle
  • 0.8 to 1.27mm Pitch

BGA/FBGA Socket

BGA/FBGA

  • Open Top or Clam Shell
  • 10,000 Life Cycle
  • 0.5mm to 1.0mm Pitch

FBGA Socket

FBGA

  • Open Top
  • 0.75mm-0.8mm Pitch
  • -65° to +150°C

BGA Memory Socket

BGA Memory Sockets

  • Open Top Actuated Sockets
  • Multiple Package Outlines & Heights
  • Removable Adapter

QFP Socket

QFP for Gull Wing Leads

  • Open Top or Clam Shell
  • 0.4 to 1.0mm Pitch
  • 0,000 Life Cycles; -65° to +150°C

SOIC Socket

SO, SOIC, Gull Wing, Open Top

  • SOP: 1.27mm
  • SSOP: 0.5 to 0.8mm
  • TSSOP: 0.5 to 0.65mm

TSOP Socket

TSOP Unique Positive Locking Lid

  • SMT & ZIF
  • For Prototyping, OEM, Test
  • With or Without Alignment Pins

TO Socket

Transistor Outline (TO)

  • Top-Loading & Clam Shell (ZIF)
  • Kelvin & Single-Sided Contacts
  • Positive Contact Wiping Action

Socket Receptacle

Socket Receptacles

  • Protect Valuable Test & Burn-In sockets
  • Can be Custom Manufactured
  • Soldered or Wire wrapped to the PCB

PGA - ZIF Socket

PGA - ZIF

  • Over 10,000 Insertions
  • 10x10 to 25x25 Grid on 1.00mm Centers
  • Fully Loaded or Custom Pattern

ZIP DIP Socket

ZIP DIP

  • Over 10,000 Insertions
  • 0.100" (2.54 mm)
  • 14 to 64 Leads

LCC Socket

LCC

  • Open Top or Clam Shell
  • From 0.25mm
  • Live or Dead Bug Options

PLCC Socket

PLCC

  • Surface Mount/Through-Hole
  • RoHS Compliant
  • Compatible with Automated Loading Equipment

Optical Transceiver Socket

Optical Transceiver Sockets

  • Surface Mount
  • 0.5 to 1.27mm
  • 50,000 Insertions

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