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Adapters & Converters

BGA Switch-A-Pitch Adapters Fine Pitch Bump Adapters for Use with 0.40mm Pitch Boards Correct-A-Chip™ Socket
with Collet Contacts
RoHS/WEEE-Compliant
PLCC-to-DIP Adapter
BGA Switch-A-Pitch Adapters Fine Pitch Bump Adapters Correct-A-Chip&tradel Socket with Collet Contacts RoHS/WEEE-Compliant PLCC-to-DIP Adapter
  • Reduce high-density interconnect (HDI) construction by adapting smaller pitch devices to larger footprints
  • Convert 0.4mm and 0.5mm pitch footprints to 1.0mm or 1.27mm pitch
  • Enable the use of standard line and trace spacing
  • Eliminate the need for laser-drilled micro vias motherboard
  • Adapt to fine pitch footprints including TSSOPs and QFPs with pitches down to 0.4mm
  • Features raised connection pads up to 0.010" (0.25mm)
  • Available in tape-and-reel for high-speed surface-mount technology (SMT) assembly
  • Can be manufactured for RoHS Compliance
  • Correct-A-Chip™ technology solves problems associated with the use of alternate ICs by eliminating the need for new PCBs
  • Available in either 0.300" (7.62mm) or 0.600" (15.24mm) row-to-row spacing
  • Converts PLCC packaged ICs-to-DIP footprints
  • Ideal for prototyping and testing/evaluation
  • Available with PLCC sockets or PLCC Pads on top side
High-Temperature SOIC DIP Adapter PLCC-to-DIP Adapter QFP-to-PGA Adapter
for JEDEC 132-Position
QFP-to-PGA Adapter
for Motorola DSP56000/001
High-Temperature SOIC DIP Adapter PLCC-to-DIP Adapter QFP-to-PGA Adapter for JEDEC QFP-to-PGA Adapter for Motorola
  • A cost-effective means of upgrading to SOIC without changing your printed circuit board layout for adapters on 0.400" (10.16mm) or 0.600" (15.24mm) centers
  • Converts PLCC packaged ICs to DIP footprints for prototyping, testing, and evaluation
  • Available with with PLCC sockets or pads on top side
  • Convert surface-mount QFP packages to a 13 x 13 PGA footprint, reducing costs by using less-expensive QFP packages to replace PGA footprints in existing designs
  • Convert Motorola's DSP56000/001 QFP surface-mount packages to a 13 x 13 to PGA footprint, reducing costs by using less-expensive QFP packages to replace the PGA footprint
SOIC-to-DIP QFP Adapters PLCC-to-PGA
SOIC-to-DIP Adapters QFP Adapters PLCC-to-PGA Adapters
  • Designed to convert rectangular type, 0.050" (1.27mm) pitch SOIC devices for soldering or socketing in a dual in-line (DIP or DIL) application
  • Convert BGA, LGA, or other device packages to an existing QFP to QFP with the same or different footprint. Available in 0.50mm to 1.27mm pitch
  • Adapts JEDEC 0.050" (1.27mm) pitch PLCC packages (Leaded Type A) to standard PGA footprints. Polarization pin option available