Sn63/Pb37 Water Soluble Solder Paste
- Reduces BGA voiding to under 5%
- 8 hour stencil life
- Consistent printing over a range of temperatures and humidity levels
- Wets excellently to AgPb leaded components
- Reduces scrap due to less paste dry out
- Residues easily removed with Hot DI water
- Classified as ORH0 per J-STD-004
- Compatible with enclosed printing systems
- Shelf life 6 month from DOM, when handled properly.
- Non-stocked Kester items may be subject to minimum orders.
Kester R560 is an organic acid, water-soluble solder paste formula specifically designed to reduce voiding in Ball Grid Array (BGA) solder connections. The voiding in BGA's has been shown to be reduced from 25% to less than 5%. R560 is also resistant to extremes in temperature and relative humidity. R560 is designed to be slump resistant in high humidity conditions. The solder paste exhibits long stencil life and tack time, while still delivering exceptional solderability to a wide variety of metallic substrates. The activator package in this formula is very aggressive, providing superior wetting to OSP coated boards and Ag/Pd leaded components.
| Unidad de venta | Caja |
|---|---|
| SKU | G100352 |
| Modelo del fabricante | R560 |
| Marca | Kester |
| Material | Sn63/Pb37 |
| Tipo | Soluble en agua |
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