PillowStat Component Packaging with Foam

CCI's new concept in component packaging includes (2) 1/8" conductive foam "pillow pads" inside a static shielding injection molded plastic box. The unique conductive foam tends to form around the encapsulated item. Ball grid arrays, wafers, and components with fine pitched leads are possible applications. Conductive plastic box ships assembled with foam inserted and an ESD safe label attached.

This design competes very favorably with the "sticky gel" products on price and has better ESD properties. The "stick gel" can be insulative. CCI's foam is conductive and will not generate a charge. Perfect for ESD sensitive, fragile and expensive components. Fits any size component.