Solder Analysis Kit for Leaded Sn/Pb Alloys
The solder in a wave solder machine can become contaminated with other metals dissolved during the soldering process. These impurities can affect the physical characteristics and wetting ability of the solder, and may possibly result in defects such as icycling, bridging, pin-holes, webbing and non-wetting.
Solder Analysis Service
The AIM Solder Analysis Service is a program of scheduled analysis that can increase wave soldering throughput and reliability and reduce the rework of soldered assemblies. In order to maintain solder purity, a program of regularly scheduled pot analysis is recommended. The program allows customers to track solder pot impurities for conformance to IPC and/or internal requirements.
Analysis Report
AIM's Solder Pot Analysis Program provides a complete quantitative report on solder pot composition for preventive maintenance or for solving specific solder-related problems. AIM's analytical services are most often used to assure the solder pot has not become contaminated with other metals. Samples are analyzed to determine concentrations for tin and lead and a wide variety of contaminants through the use of analytical spectroscopy.
Customer sends in a sample for analysis, using an authorized envelope. The sample should be 1" wide x 2" long or weigh 200 grams. Samples can be sent to the closest AIM facility.
| Sell Unit | Each |
|---|---|
| PAC Item Code | I223489 |
| MFG Part Number | 8668-LEADED |
| Brand | AIM Solder |
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