88.5% SAC305 Lead-Free NC257 No-Clean Solder Paste, Type 4, 500g Jar

NC257 has been developed to offer extremely broad process windows for printing, wetting, and pin-probe testing. The superior wetting ability of NC257 results in bright, smooth, and shiny solder joints. It also offers very low post-process residues, which remain crystal clear and easily probed even at the elevated temperatures required for today's lead-free alloys. This alloy offers a chemistry developed for use in air reflow, as well as providing slump and humidity tolerances to extend the useable life in facilities where environmental control is not at its optimum.

• RoHS Compliant
• Vapor Phase Compatible
• Broad Printing Process Window
• 24-Hour Stencil Life
• Clear Pin-Probe Testable Residue
• 12-14 Hour Tack Time
• Reduces Voiding Under Micro-BGAs
• Excellent Wetting, Even Leadless Devices