Indium 3.2HF

SAC305 Lead-Free Water Soluble Solder Paste

Lead-Free

Indium3.2HF is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, Sn/Sb, and other Pb-free alloy systems. This product formulation offers consistent, repeatable printing performance combined with a long stencil life and sufficient tack strength to handle the challenges of today's high-speed as well as high-mix surface mount lines. In addition to consistent printing and reflow requirements, this solder paste offers superb wetting to the various Pb-free metallizations and has exceptional low-voiding performance on fine-pitch components, including BGAs and CSPs.

Exceptional printing
Long stencil life
Good response-to-pause
Wide reflow profile window
Outstanding slump resistance
Excellent wetting capability
Superior fine-pitch soldering ability
Low-voiding
Halogen-free

Grouped product items
Product Name	Qty
Indium 801159-500G SAC305 Lead-Free Water Soluble 88.25% T4 Solder Paste, 500g Jar $148.37
Indium 801159-600G SAC305 Lead-Free Water Soluble 88.25% T4 Solder Paste, 600g Cartridge $178.05
Indium 801640-500G SAC305 Lead-Free Water Soluble 89% T3 Solder Paste, 500g Jar $142.49
Indium 801640-600G SAC305 Lead-Free Water Soluble 89% T3 Solder Paste, 600g Cartridge $170.99

Skip to the beginning of the images gallery

Technical Documents

Product Info & TDS Sheets

Indium3.2HF Solder Paste Technical Data Sheet

Details

Features

Type: Lead-Free 3.2HF Water Soluble Solder Paste Type 3 Metal Load: 88.50% (800640)
Type: Lead-Free 3.2HF Water Soluble Solder Paste Type 4 Metal Load: 88.25% (801159)
Shelf Life: 6 months
Alloy: SAC305 (Sn96.5Ag3Cu0.5) Type: Water Soluble
Storage Conditions: <10°C (unopened containers)
Wide reflow process window
J-Standard-005A, Flux Classification: ORH0, J-Standard-004B
Excellent wetting on a variety of surface finishes
Compatible Products:
- Rework Flux: TACFlux® 032HF
- Cored Wire: CW-301
- Wave Flux: 1095-NF
- Flux Pen: FP-300

Alloys

Indium Corporation manufactures low-oxide spherical powder composed of a variety of Pb-free alloys that cover a broad range of melting temperatures. Type 3 and Type 4 powder sizes are the standard offering with Sn/Ag/Cu, Sn/Ag, and Sn/Sb Pb-free alloy systems. The metal percent is the weight percent of the solder powder in the solder paste and is dependent upon the powder type and application.

More Information