Indalloy 303 (Bi+) Bi57/Sn42/Ag1 Low Temperature Halogen-Free No-Clean Solder Paste
Indium5.7LT-1 is an air reflow, halogen-free, no-clean solder paste designed for assembly processes using Bi-based and In-based low-temperature alloys. This paste is a clear residue product with exceptional wetting capabilities. The low activation temperature of Indium5.7LT-1, in combination with the SnBi alloys, can be especially useful as a low-temperature, Pb-free solution.
- Low-temperature Pb-free solution
- Outstanding printing transfer efficiency with low variation between prints
- Clear post-reflow flux residue
- Solder beading and solder balling minimization performance
- Exceptional wetting in air and nitrogen reflow
- Halogen-free per EN14582 test method
Features
- Type: 5.7LT-1 Indalloy 303 (Bi+) Solder Paste Halogen-Free, Low Temperature, No-Clean Type 4, Metal Load 89.50%
- Shelf Life: 6 months
- Alloy: (Bi+) TYPE: No-Clean
- Storage Conditions: <10°C (unopened containers)
- J-Standard-004 (IPC-TM-650) J-STD-005 (IPC-TM-650)
- Compatible Products:
- Rework Flux: TACFlux® 571HF & TACFlux® 020RC
- Liquid Rework Flux: FP-500
- Excellent thermal cycling performance
- Reflow temperature as low as 170°C
- Resistant to hot tearing
- Compatible with SAC in hybrid BGA joints
Alloys
Indium Corporation manufactures low-oxide spherical powder composed of the 58Bi/42Sn eutectic alloy in the industry standard Types 3 and 4 mesh sizes. Other non-standard mesh sizes are available upon request. The weight ratio of the flux/vehicle to the solder powder is referred to as the metal load and is typically in the range of 83-92% for standard alloy compositions.
PAC Item Code | G101007 |
---|---|
MFG Part Number | 5.7LT-1 |
Brand | Indium |
Material | Bi57/Sn42/Ag1 |
Type | No Clean |
Notes | Halogen-Free |