Indium 6.6HF

SAC305 Lead-Free Water Soluble Solder Paste

Lead-Free

Indium6.6HF is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It is capable of SnPb and Pb-free assembly processes with an exceptional reflow process window. This solder paste provides exceptional stencil printing performance, with long stencil life and excellent response-to-pause.

Indium6.6HF exhibits superior wetting to a variety of surface finishes and exhibits the best voiding performance, with fewest voids, reduced size of largest voids, and overall minimized voiding for BGAs, CSPs, and BTCs (QFNs, DPAKs, LGAs, etc.).

  • Low-voiding water-soluble flux for solder paste
    • Reduced largest voids
    • Fewer voids
    • Minimized voiding overall
    • For BGA, CSP, and bottom termination components, such as QFNs and DPAKs
  • Exceptional printing process window
    • Excellent response-to-pause
    • Long stencil life
    • Prints consistently at a wide range of speeds
  • Wide reflow process window
  • Excellent wetting on a variety of surface finishes
  • Maintains tack over time
  • Outstanding cleanability
Grouped product items
Product Name Qty
Indium 801641-500G
SAC305 Lead-Free Water Soluble 88.5% T4 Solder Paste, 500g Jar
$148.37
Indium 801641-600G
SAC305 Lead-Free Water Soluble 88.5% T4 Solder Paste, 600g Cartridge
$178.05
Indium 801643-500G
SAC305 Lead-Free Water Soluble 89% T3 Solder Paste, 500g Jar
$170.99
Indium 801643-600G
SAC305 Lead-Free Water Soluble 89% T3 Solder Paste, 600g Cartridge
$170.99

Technical Documents

Features

  • Type: Lead-Free 6.6HF Water Soluble Halogen-Free Solder Paste Type 3 Metal Load: 89.00% (801643)
  • Type: Lead-Free 6.6HF Water Soluble Halogen-Free Solder Paste Type 4 Metal Load: 88.50% (801641)
  • Shelf Life: 6 months
  • Alloy: SAC305 (Sn96.5Ag3Cu0.5) Type: Water Soluble
  • Storage Conditions: <10°C (unopened containers)
  • Halogen-free per EN14582 test method
  • J-Standard-004A, Flux Classification: ORH0, J-Standard-005A
  • Compatible Products:
    • Rework Flux: TACFlux® 66HF
    • Cored Wire: CW-305
    • Wave Flux: 1095-NF, WF-1082
  • For BGA, CSP, and bottom termination components, such as QFNs and DPAKs

Alloys

Indium Corporation manufactures low-oxide spherical powder composed of eutectic SnPb and SnPbAg as well as many Pb-free alloys for printed circuit board assembly in the industry standard Types 3 and 4 mesh size (J-STD-006). Other non-standard mesh sizes are available upon request. The metal load is the weight percent of the solder powder in the solder paste and is dependent upon the powder type, alloy, and application.

More Information
PAC Item Code G100998
MFG Part Number 6.6HF
Brand Indium
Material SAC305
Type Water Soluble
Notes Lead-Free
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