Indium 8.9HF

SAC305 Lead-Free, Halogen-Free No-Clean Solder Paste

Lead-Free

Indium8.9HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9HF offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of Indium8.9HF minimizes false failures in ICT. It is one of our lowest voiding pastes.

Halogen-free per EN14582 test method
Low BGA, CSP, QFN voiding
One of our most stable pastes
High transfer efficiency through small apertures (≤0.66AR)
Eliminates hot and cold slump
High oxidation resistance
Wets well to oxidized BGA and pad surfaces
Excellent soldering performance under high-temperature and long reflow processes
Clear, probe testable flux residue
Compatible with SnPb alloys

Grouped product items
Product Name	Qty
Indium 800495-500G SAC305 Lead-Free, Halogen-Free No-Clean 88.5% T4 Solder Paste, 500g Jar $200.66
Indium 800495-600G SAC305 Lead-Free, Halogen-Free No-Clean 88.5% T4 Solder Paste, 600g Cartridge In Stock $234.43
Indium 800494-500G SAC305 Lead-Free, Halogen-Free No-Clean 89% T3 Solder Paste, 500g Jar $193.79
Indium 800494-600G SAC305 Lead-Free, Halogen-Free No-Clean 89% T3 Solder Paste, 600g Cartridge $232.55

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Technical Documents

Product Info & TDS Sheets

Indium8.9HF Lead-Free Solder Paste Technical Data Sheet

Details

Features

Type: Lead-Free 8.9HF No-Clean Halogen-Free Solder Paste Type 3 Metal Load: 88.75% (800494)
Type: Lead-Free 8.9HF No-Clean Halogen-Free Solder Paste Type 4 Metal Load: 88.25% (800495)
Shelf Life: 12 months
Alloy: SAC305 (Sn96.5Ag3Cu0.5) Type: No-Clean
Storage Conditions: <10°C (unopened containers)
High transfer efficiency through small apertures (≤0.66AR)
Halogen-free per EN14582 test method
J-Standard-004B, Flux Classification: ROL0
Low BGA, CSP, QFN voiding
Compatible Products:
- Rework Flux: TACFlux® 020B-RC, TACFlux® 089HF
- Cored Wire: CW-807, Core 230-RC
- Wave Flux: WF-9945, WF-9958
High transfer efficiency through small apertures (≤0.66AR)
Eliminates hot and cold slump
High oxidation resistance
Wets well to oxidized BGA and pad surfaces
Excellent soldering performance under high-temperature and long reflow processes
Clear, probe testable flux residue
Compatible with SnPb alloys

Alloys

Indium Corporation manufactures low-oxide spherical powder composed of a variety of Pb-free alloys that cover a broad range of melting temperatures. This document covers Types 3 and 4 powders as standard offerings with SAC alloys. Other alloys may be available with this flux vehicle upon request. The metal percent is the weight percent of the solder powder in the solder paste and is dependent upon the powder type and application.