Indium 8.9HF1

SAC305 Lead-Free, Halogen-Free No-Clean Solder Paste

Lead-Free

Indium8.9HF1 is an air reflow, no-clean solder paste. Indium8.9HF1 offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of Indium8.9HF1
minimizes false failures in ICT.

High oxidation barrier to eliminate graping and HIP defects
Highly probe-testable flux residue
Halogen-free per EN14582 test method
Excellent print transfer efficiency on 0.4mm pitch CSPs

Grouped product items
Product Name	Qty
Indium 800596-500G SAC305 Lead-Free, Halogen-Free No-Clean 88.25% T4 Solder Paste, 500g Jar $148.37
Indium 800596-600G SAC305 Lead-Free, Halogen-Free No-Clean 88.25% T4 Solder Paste, 600g Cartridge $178.05
Indium 800595-500G SAC305 Lead-Free, Halogen-Free No-Clean 88.5% T3 Solder Paste, 500g Jar $142.49
Indium 800595-600G SAC305 Lead-Free, Halogen-Free No-Clean 88.5% T3 Solder Paste, 600g Cartridge $170.99

Skip to the beginning of the images gallery

Technical Documents

Product Info & TDS Sheets

Indium8.9HF1 Lead-Free Solder Paste Technical Data Sheet

Details

Features

Type: Lead-Free 8.9HF1 No-Clean Halogen-Free Solder Paste Type 3 Metal Load: 88.50% (800595)
Type: Lead-Free 8.9HF1 No-Clean Halogen-Free Solder Paste Type 4 Metal Load: 88.25% (800596)
Shelf Life: 6 months
Alloy: SAC305 (Sn96.5Ag3Cu0.5) TYPE: No-Clean
Storage Conditions: <10°C (unopened containers)
J-Standard-004B, Flux Classification: ROL0
Compatible Products:
- Rework Flux: TACFlux® 020B-RC, TACFlux® 089HF
- Cored Wire: CW-807
- Wave Flux: WF-9945, WF-9958

Alloys

Indium Corporation manufactures low-oxide spherical powder composed of a variety of Pb-free alloys that cover a broad range of melting temperatures. This document covers Type 3 and Type 4 powder as standard offerings with SAC alloys. The metal percent is the weight percent of the solder powder in the solder paste and is dependent upon the powder type and application. Standard product offerings are detailed in the following table.

More Information