Indium RMA-155

SAC305 Lead-Free No-Clean Solder Paste

Lead-Free

RMA-155 is an air reflow, RMA solder paste formulated to accommodate a variety of alloys for electronics assembly. RMA-155 has balanced performance to accommodate the widest variety of processes including: consistent stencil printing transfer, robust reflow window, and residue compatible with in-circuit testing.

RMA paste for SnPb and Pb-free alloys
Halogen-free per EN14582 test method
High-performance stencil printing characteristics
Eliminates hot and cold slump
Robust reflow performance to accommodate assembly of BGA and components with large ground planes
High oxidation resistance
Clear, probe-testable post-reflow residues
Maintains very high resistance during SIR testing
Ideal for mixed alloy SnPb and Pb-free processes
Available with SACm® for high-reliability Pb-free performance with low Ag content

Grouped product items
Product Name	Qty
Indium 801077-500G SAC305 Lead-Free No-Clean 88.5% T4 Solder Paste, 500g Jar $148.37
Indium 801077-600G SAC305 Lead-Free No-Clean 88.5% T4 Solder Paste, 600g Cartridge $178.05

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Technical Documents

Product Info & TDS Sheets

Indium RMA-155 Solder Paste Technical Data Sheet

Details

Features

Type: Lead-Free RMA-155 No-Clean Solder Paste Type 4 Metal Load: 88.50% (801077)
Shelf Life: 6 months
Alloy: SAC305 (Sn96.5Ag3Cu0.5) TYPE: No-Clean
Storage Conditions: <10°C (unopened containers)
J-Standard-004A, Flux Classification: ROL0, J-STD-005A (IPC-TM-650)
Compatible Products:
- Rework Flux: TACFlux® 089HF
- Cored Wire: CW-807
- Wave Flux: WF-9945, WF-9958

Alloys

Indium Corporation manufactures low-oxide spherical powder composed of a variety of Pb-free alloys that cover a broad range of melting temperatures. Types 4 and 3 powders are standard offerings with SAC alloys. The metal load is the weight percent of the solder powder in the solder paste and is dependent upon the powder type, alloy, and application.

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