ALPHA HiTech 259033.0070GME

CU11-3127 Underfill Epoxy, 50cc EFD Syringe, 70g

Key Features

Low moisture absorption
Releases stress over a large area, primary stress is CTE mismatch between component and board
High Glass Transition Temperature (Tg)
Low Coefficient of Thermal Expansion
Halogen-free
Complies with RoHS Directive 2011/65/EU

$76.17

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Technical Documents

SDS/MSDS Sheets

ALPHA HiTech CU11-3127 Safety Data Sheet

Product Info & TDS Sheets

ALPHA HiTech CU11-3127 Technical Data Sheet

Details

ALPHA HiTech CU11-3127, a product with high filler content, is available to provide better mechanical strength for CSP and Flip Chip packages. ALPHA HiTech CU11-3127 provides full bottom component coverage at room temperature.

A higher preheat temperature up < 80° C may be applied to the substrate for a faster underfill flow rate.

More Information