CU31-2030 Reworkable Underfill Epoxy
Key Features
- Low viscosity
- Room temperature flow capability
- High Glass Transition Temperature (Tg)
- Low modulus
- Reworkable
- Excellent reliability performance
- Halogen-free and complies with RoHS Directive 2015/863/EU
ALPHA HiTech CU31-2030 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a low viscosity underfill which enables fast and efficient flow properties. In addition, it has a high Tg and low modulus which results in excellent reliability performance. ALPHA HiTech CU31-2030 is suitable for assembling BGA, CSP and Flip Chip devices. All ALPHA HiTech products are Halogen Free.
| PAC Item Code | G100650 |
|---|---|
| MFG Part Number | CU31-2030 |
| Brand | ALPHA HiTech |
| Type | Underfill |
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