Kester EM828

SAC305 Sn96.5/Ag3.0/Cu0.5 Lead-Free Water Soluble Solder Paste

Lead-Free

Low-voiding underneath area array components
Excellent wetting on a variety of mentalizations
Residues are easily removed in hot DI water
Long stencil life and tack time (process dependent)
Tremendous brick definition and slump resistance for reduction of bridging defects
Print speed up to 150 mm/second (6 inch/second)
Capable of breaks in printing of up to 60 minutes without any kneading
Classified as ORH1 per J-STD-004A
Shelf life is 6 months from date of manufacture and held at 0 to 10°C (32 to 50°F).
Screen/Stencil Printing
Non-stocked Kester items may be subject to minimum orders.

Grouped product items
Product Name	Qty
Kester 70-0403-0810 SAC305 Lead-Free Water Soluble 89.5% T3 Solder Paste, 500g Jar (Box of 10) $1,249.92
Kester 70-0403-0823 SAC305 Lead-Free Water Soluble 89.5% T3 Solder Paste, 500g Cartridge (Box of 10) $1,249.92
Kester 70-0403-0923 SAC305 Lead-Free Water Soluble 89.5% T4 Solder Paste, 500g Cartridge (Box of 10) $1,412.42
Kester 70-0403-0910 SAC305 Lead-Free Water Soluble 89.5% T4 Solder Paste, 500g Jar (Box of 10) $1,412.42

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Technical Documents

Product Info & TDS Sheets

Kester EM828 Solder Paste Data Sheet

SDS/MSDS Sheets

Kester EM828 Wire Solder Safety Data Sheet (SDS)

Warranty

Kester Product Warranty

Details

Kester EM828 is a lead-free, water-soluble solder paste formulated specifically to reduce voiding behavior that is common with lead-free solder paste products. EM828 represents a break-through in water-soluble solder paste technology with the combination of low voiding, excellent wetting behavior and ease of cleaning. Additionally, EM828 is extremely stable in the stencil printing process, regardless of print speed, idle time and throughput. EM828 provides tremendous wetting to a wide variety of board and component finishes in order to simplify your transition to lead-free processes.

More Information