Kester EM907

SAC305 Sn96.5/Ag3.0/Cu0.5 Lead-Free No-Clean Solder Paste

Lead-Free

Lead-Free Joints that Closely resemble those achieved with SnPb solder paste
Excellent solderability to a wide verity of surface metallization, including NiAu, ImSn and ImAg.
High Print speeds up to 150 mm/sec
Capable of 60 minute break times in printing.
Stencil Life: 12+ hours (process dependent)
Excellent printing characteristics to 16 and 20 mils pitch.
Excellent print and reflow characteristics for 0201 applications.
Stable tack life
Classified as ROL1 PER J-STD-004. J-STD-004A & J-STD-004B
Screen/Stencil Printing
RoHs Compliance
Shelf life is 4 months from date of manufacture and held at 0 to 10°C (32 to 50°F).
Non-stocked Kester items may be subject to minimum orders.

Grouped product items
Product Name	Qty
Kester 70-0605-0810 SAC305 Lead-Free No-Clean 88.5% T3 Solder Paste, 500g Jar (Box of 10) $1,367.00
Kester 70-0605-0811 SAC305 Lead-Free No-Clean 88.5% T3 Solder Paste, 500g Cartridge (Box of 10) $1,640.40
Kester 70-0605-0819 SAC305 Lead-Free No-Clean 88.5% T3 Solder Paste, 750g DEK (Box of 10) $2,474.25
Kester 70-0605-0910 SAC305 Lead-Free No-Clean 88.5% T4 Solder Paste, 500g Jar (Box of 10) $1,611.17
Kester 70-0605-0911 SAC305 Lead-Free No-Clean 88.5% T4 Solder Paste, 600g Cartridge (Box of 10) $1,933.40

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Technical Documents

Product Info & TDS Sheets

Kester EM907 Solder Paste Data Sheet

SDS/MSDS Sheets

Kester EM907 Wire Solder Safety Data Sheet (SDS)

Warranty

Kester Product Warranty

Details

Kester EM907 is a lead-free, air and nitrogen reflowable, no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including the SAC305 alloy. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. EM907 is capable of stencil printing downtimes up to 60 minutes with an effective first print down to 20 mils without any kneading.

EM907 also exhibits excellent continual printability for fine pitch (0.4mm/16 mils) and is able to print at high speeds up to 6 in/s (150 mm/s).Kester EM907 is a lead-free, air and nitrogen reflowable, no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including the SAC305 alloy.

The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. EM907 is capable of stencil printing downtimes up to 60 minutes with an effective first print down to 20 mils without any kneading. EM907 also exhibits excellent continual printability for fine pitch (0.4mm/16 mils) and is able to print at high speeds up to 6 in/s (150 mm/s).

More Information