Kester EP256

Sn63/Pb37 No-Clean Solder Paste

Stable wetting behavior over a wide range of profiles
Capable of 90 minute break times in printing
High print speeds to 200+ mm/sec
Compatible with enclosed print head speeds
High activity on all substrates, including OSPs
Excellent printing characteristics to 0.4 mm (16 mil) pitch with Type Powder
Capable of off-pad printing with no solder balls after reflow
Stencil life: 8+ hours (process dependent)
Scrap is reduced due to less paste dry out
Stable tack over 8+ hours
Classified as ROL1 per IPC J-STD-004B
Shelf life 6 month from DOM, when refrigerated
Non-stocked Kester items may be subject to minimum orders.

Grouped product items
Product Name	Qty
Kester 70-0102-0510 Sn63/Pb37 No-Clean 90.0% T3 Solder Paste, 500g Jar (Box of 10) $907.50
Kester 70-0102-0511 Sn63/Pb37 No-Clean 90.0% T3 Solder Paste, 600g Cartridge (Box of 10) $1,089.00
Kester 70-0102-0519 Sn63/Pb37 No-Clean 90.0% T3 Solder Paste, 750g DEK (Case of 10) $1,633.75
Kester 70-0102-0618 Sn63/Pb37 No-Clean 90.0% T4 Solder Paste, 1,400g Cartridge (Box of 10) $3,301.67
Kester 70-0102-0610 Sn63/Pb37 No-Clean 90.0% T4 Solder Paste, 500g Jar (Box of 10) $1,077.50
Kester 70-0102-0611 Sn63/Pb37 No-Clean 90.0% T4 Solder Paste, 600g Cartridge (Box of 10) $1,209.86

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Technical Documents

SDS/MSDS Sheets

Kester EP256 Sn63/Pb37 Safety Data Sheet

Product Info & TDS Sheets

Kester EP256 Solder Paste Data Sheet

Warranty

Kester Product Warranty

Details

EP256 is a no-clean, air or nitrogen reflowable solder paste specifically designed for maximum robustness in reflow profiling and stencil printing. EP256 has the widest possible reflow processing window. EP256 is also capable of stencil printing downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256 is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning.

More Information