Kester R520A

SAC305 Sn96.5/Ag3.0/Cu0.5 Lead-Free Water Soluble Solder Paste

Lead-Free

Lead-Free and water soluble
High Print speeds up to 150 mm/sec
Stable tack life to long stencil life
Consistent printing over a range of temperatures and humidity's
Excellent wetting onto Ag/PB leaded components
Reduces Scrap due to less paste dry out
Residues easily removed with hot DI water
Classified as ORH0 per J-STD-004
Shelf life 4 months from date of manufacture refrigerated.
Non-stocked Kester items may be subject to minimum orders.

Grouped product items
Product Name	Qty
Kester 70-1903-0810 SAC305 Lead-Free Water Soluble 89.5% T3 Solder Paste, 500g Jar (Box of 10) $1,649.08
Kester 70-1903-0811 SAC305 Lead-Free Water Soluble 89.5% T3 Solder Paste, 600g Cartridge (Box of 10) $1,978.90
Kester 70-1903-0911 SAC305 Lead-Free Water Soluble 89.5% T4 Solder Paste, 600g Cartridge (Box of 10) $2,273.90

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Technical Documents

Warranty

Kester Product Warranty

Product Info & TDS Sheets

Kester R520A Solder Paste Data Sheet

SDS/MSDS Sheets

Kester R520A Solder Paste Safety Data Sheet (SDS)

Details

Kester R520A is a lead-free, organic acid, water-soluble solder paste formula specifically designed for use with the higher temperature Pb-Free alternative soldering alloys such as Sn96.5Ag3.0Cu0.5 (SAC Alloys). The solder paste exhibits long stencil life and tack time, while still delivering exceptional solderability to a wide variety of metallic substrates. R520A was formulated to release consistently from the stencil for those critical fine pitch applications (0.5 mm/20 mils) with anti-slump characteristics and preferred solder deposit definition. The activator package in this formula is extremely aggressive, providing superior wetting to OSP coated and Immersion Gold over Electroless Nickel (ENIG) boards. R520A is an extremely stable water-soluble formula.

More Information