No-Clean Paste Flux
Kester TSF-6592 is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any lead-free soldering application that requires a very tacky flux.
Non-stocked Kester items may be subject to minimum orders.
PAC Item Code | G100305 |
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MFG Part Number | TSF-6592 |
Brand | Kester |
Type | No Clean |
Notes | Lead-Free |