Tflex™ SF10 Series Thermal Gap Filler
Tflex™ SF10 is an innovative, high performing thermal material in Laird's gap filler portfolio. This silicone free material measures 10 W/mk and has excellent deflection properties which provides minimal pressure on components during deflection. Very little pressure is required to reach the lowest possible thermal resistance.
Features
- Silicone free formulation
- Low pressure versus deflection
- Excellent surface wetting for low contact resistance
- Exceptionally low thermal resistance
- No Fiberglass reinforcement
- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
Technical Documents
Capabilities
Automated Packaging | Automated Pad Placement | Custom Automation | Custom Product Development | Modeling | Prototyping | Service | Testing
Industries
Aerospace/Defense | Automotive | Consumer | Industrial | Telecom/Datacom
Applications
Automotive Electronics | Automotive ADAS | Automotive Powertrain/ECUs |Automotive Infotainment | Routers | Hard Disk Drives | Solid State Drives | Wireless infrastructure | Drones/Satellites | Gaming Systems | Smart Home Devices | Notebooks/Tablets/Portable Devices
Specifications
- Construction & Composition: Ceramic filled silicone free thermoplastic
- Color: Grey
- Thermal Conductivity (W/mK): 10
- Density (g/cc): 3.7
- Hardness Shore 00 (3 second): 41 (1mm-4mm), 70 (0.5mm-0.75mm)
- Outgassing TML (weight %): 0.33
- Outgassing CVCM (weight %): 0.15
- Temperature Range: -40-125°C
- Thermal Resistance (1.5mm) @ 30% deflection, 50°C: 1.312°C-cm2/W (0.203 Cin2/W)
- Dielectric Constant @ 1 MHz: 9
- UL Flammability Rating: V-0
- Volume Resistivity: 1014 Ohm-cm
| PAC Item Code | G100989 |
|---|---|
| Brand | Laird |
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