Tpli™ 200 Series Silicone Based Thermal Gap Filler
Tpli™ 200 is a premium gap filler. A unique blend of boron nitride and silicone produce the highest performing interface pad. Its exceptional combination of high thermal conductivity and compliancy generate unmatched thermal resistances in a gap filling interface material.
Tpli™ 200 absorbs shock and relieves stresses, thus minimizing potential damage to components. It is electrically insulating, stable from -45°C to 200°C, and meets UL 94 HB rating.
Features
- Soft and compliant
- High Thermal performance
- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
Technical Documents
Capabilities
Automated Packaging | Automated Pad Placement | Custom Automation | Custom Product Development | Modeling | Prototyping | Service | Testing
Industries
Aerospace/Defense | Automotive | Consumer | Industrial | Telecom/Datacom
Applications
Automotive ADAS | Automotive Electronics | Automotive Infotainment | Automotive Powertrain/ECUs | Drones/Satellites | Gaming Systems | Instrumentation | Notebooks/Tablets/Portable Devices | Routers | Smart Home Devices | Wireless infrastructure
Specifications
- Construction & Composition: Boron nitride filled silicone sheet
- Thermal Conductivity (W/mK): 6.0
- Density (g/cc): 1.4
- Hardness (Shore 00): 70
- Outgassing TML (weight %): 0.46
- Outgassing CVCM (weight %): 0.15
- Temperature Range: -45-200°C
- Rth@ 40 mils, 10 psi, 50°C: 0.25°C-in2/W
- Dielectric Constant @ 10GHz: 3.2
- UL Flammability Rating: HB
- Volume Resistivity: 5x1013 Ohm-cm
| PAC Item Code | G100983 |
|---|---|
| Brand | Laird |
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